Wafer Handling
Micro Materials distributes a range of H-Square tools and equipment items for the semiconductor and related industries.
These products include a wide range of vacuum handling tools and manual picks and tweezers for mask handling, full size wafers and smaller pieces. Their custom department can design and manufacture specific wafer cassettes and manual handling products in a variety of materials to suit customer specific applications. Equipment items include Wafer Presentation Systems, Flat Finders and Wafer Transfer Systems.
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PTFE – Single Wafer Dippers
Applications of single-wafer and multi-wafer dippers.
Catering for multiple substrate sizes from small square
pieces up to full-size round wafers from 2-inch diameter
up to 6-inch diameter. Small quantities.
Various designs including handles, perforated lids, and
some with PTFE screws. Custom designs and
modifications are also available.
Applications:
- Single wafer processing.
- Multi Wafer processing.
- Etching and developing
- Full-size Vertical Dippers
- Single wafer processing.
- Multi Wafer processing.
- Etching and developing
- Horizontal and vertical loading options
- Small Die Wet chemical processes
Breezes
The Breeze wand (horizontal and vertical) is a non-contact wafer handling wand that uses the Bernoulli principle to lift and hold the substrate securely without touching it.
Four “corral” pins keep the substrate centred on the wand. Ideally suited for wafers with etched cavities or Taiko wafers.
Freedom Wand
Self-contained cordless battery-powered vacuum wand allows freedom from vacuum lines.
Mechanical Pick
Used for handling wafers from the tangential edge (no front/back wafer contact). Grippers are Teflon® PTFE. For single-wafer chemical processing, or wafer rescue. Adjustable tensioner screw can adjust the amount of force on the wafer. A single wafer presenter (WPR or HL) is used access wafers from a cassette.