LCS2™ Waffle Pack Lid/Clip Super System

Developed in partnership with BAE Systems, Gel-Pak’s patent-pending Lid/Clip Super System (LCS2) prevents thin semiconductor die from migrating out of waffle pack/chip tray pockets during shipping and handling. The lid is designed to work with a new highly engineered clip that uniformly compresses the tray and lid together.

• “Gold” coloured ESD Class 0 static dissipative moulded lid and clip (SR < E9 ohms)
• Padded lid with integrated industry-standard static dissipative Tyvek
• Eliminates the costly and laborious manual placement and misalignment and/or pinching of Tyvek inserts when loading waffle pack
• Silicone-free
• Compensates for common waffle pack lid/tray warpage that creates gaps that enable die migration
• Uniformly seals each individual tray pocket
• Saves significant costs associated with yield loss, rework labour and RMAs caused by die migration issues. 50% reduction in assembly labour