Kayaku Advanced Materials, Inc. epoxy resists consist of chemically amplified, epoxy-based negative resists that are highly functional, and photo-imageable to near UV (365nm) radiation. Cured films or microstructures are very resistant to solvents, acids and bases and have excellent thermal and mechanical stability, making them well suited for fabricating permanent structures such as pixel walls, fluidic channels and nozzles, micro arrays and spacers.
PMGI and LOR resists enable high yield, metal lift-off processing in a variety of applications from data storage and wireless ICs to MEMS. Used beneath photoresists in a bi-layer stack, PMGI and LOR extend the limits of lift-off processing beyond where single layer resist strategies can reach. This includes very high-resolution metallisation (<0.25µm), as well as very thick (> 3µm) metallisation. These unique materials are available in a variety of formularies to meet virtually any customer need.
PMMA (polymethyl methacrylate) is a versatile polymeric material that is well-suited for many imaging and non-imaging microelectronic applications. PMMA resists are simply PMMA polymer dissolved in a solvent like anisole (safe solvent). Exposure causes scission of the polymer chains. PMMA is mainly used as a high-resolution positive resist for direct write e-beam offering extremely high-resolution, ease of handling and excellent film characteristics. PMMA is also used as a protective coating for wafer thinning, as a bonding adhesive and as a sacrificial layer.