Micro Materials distributes a range of H-Square tools and equipment items for the semiconductor and related industries.
These products include a wide range of vacuum handling tools and manual picks and tweezers for mask handling, full size wafers and smaller pieces. Their custom department can design and manufacture specific wafer cassettes and manual handling products in a variety of materials to suit customer specific applications. Equipment items include Wafer Presentation Systems, Flat Finders and Wafer Transfer Systems.
The Breeze wand (horizontal and vertical) is a non-contact wafer handling wand that uses the Bernoulli principle to lift and hold the substrate securely without touching it.
Four “corral” pins keep the substrate centred on the wand. Ideally suited for wafers with etched cavities or Taiko wafers.
Used for handling wafers from the tangential edge (no front/back wafer contact). Grippers are Teflon® PTFE. For single-wafer chemical processing, or wafer rescue. Adjustable tensioner screw can adjust the amount of force on the wafer. A single wafer presenter (WPR or HL) is used access wafers from a cassette.